EDSYN TSX717
SOLDAVAC Reflow Vacuum Tip Hole Dia: .01 in. (.28 mm) L: .63 in. (16.1 mm)
TSX717
TSX717
EDSYN TSX717
SOLDAVAC Reflow Vacuum Tip Hole Dia: .01 in. (.28 mm) L: .63 in. (16.1 mm)
TSX717
TSX717
The EDSYN TSX717 SOLDAVAC Reflow Vacuum Tip (.01 in.) is designed for use with SOLDAVAC workstations for reflow soldering.
- Diameter: .01 in. (.28 mm)
- Length: .63 in. (16.1 mm)
- For use with SOLDAVAC workstations
- Ideal for reflow soldering applications
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The EDSYN TSX717 SOLDAVAC Reflow Vacuum Tip Hole Dia: .01 in. (.28 mm) L: .63 in. (16.1 mm)
| Brand | EDSYN |
|---|---|
| Condition | NEW |
